THT and mixed technology
Through-Hole PCB Assembly Services
Through-hole PCB assembly for connectors, power parts and mixed-technology boards using selective, wave or controlled hand-solder processes.
What this service solves
A controlled path from requirements to acceptance
Through-hole assembly remains valuable where mechanical strength, connector retention or power handling matters. The correct process depends on layout, component thermal sensitivity and access.
Best fit for
- Industrial control and power electronics
- Boards with connectors, relays or large components
- Mixed SMT and through-hole assemblies
Scope
Typical project deliverables
The exact scope is frozen in the quotation and approved build documentation.
| Deliverable | Control point | Customer output |
|---|---|---|
| 01 · Insertion and polarity instructions | Confirmed before material commitment | Approved assumptions and responsibilities |
| 02 · Wave, selective or hand-solder process selection | Confirmed before material commitment | Approved assumptions and responsibilities |
| 03 · Fixture and keep-out review | Controlled during manufacturing | Repeatable production instruction |
| 04 · Visual inspection criteria | Controlled during manufacturing | Repeatable production instruction |
| 05 · Lead trimming and cleaning scope | Verified before release | Inspection, test or shipment evidence by scope |
| 06 · Mechanical support review | Verified before release | Inspection, test or shipment evidence by scope |
Through-hole assembly: choose a route that fits the board
| Route to review | Design input | Buyer consideration |
|---|---|---|
| Wave solder | Solder-side layout, thermal limits and masking | Board compatibility and fixture requirements |
| Selective solder | Access around joints and adjacent components | Nozzle clearance and local thermal requirements |
| Controlled hand solder | Joint access and workmanship instructions | Operator guidance, inspection and repeatability |
| Mixed SMT / THT | Complete assembly drawings and component sequence | Protection of already assembled components |
Workflow
How a build moves forward
- 01
Qualification
Confirm product stage, quantities and commercial fit.
- 02
File review
Identify missing data and manufacturability conflicts.
- 03
Quotation
Separate material, fabrication, assembly, test and logistics assumptions.
- 04
Approval
Freeze revisions, alternates and acceptance criteria.
- 05
Build & validation
Manufacture against the approved package and record agreed results.
Before release
Issues to resolve with the build team
Record an owner and an agreed resolution for any issue that applies to your design.
- Poor hole-to-lead fit
- Shadowing and thermal imbalance
- Insufficient selective-solder access
- Manual work without defined workmanship criteria
Buyer questions
Frequently asked questions
Which soldering process is best for THT?
Wave solder suits compatible volume layouts, selective solder provides targeted control, and hand soldering can fit low-volume or inaccessible locations. The board design determines the best choice.
Can SMT and THT be combined?
Yes. Mixed-technology builds require an agreed process sequence and attention to component temperature limits and solder-side clearances.
How is workmanship judged?
Acceptance should reference the customer drawing and an agreed workmanship standard and class, with any special criteria documented before build.
Next step
Ready for a build review?
Share your project stage, quantity and target date. We will confirm the files, process and testing information needed for an accurate quotation.