Verified PCB & PCBA manufacturingVerified quality
Quality Control Built Into Every Stage
Quality begins with an approved build package and follows the product through material, process, inspection, test and final release.
Quality planning
Define acceptance before production
The customer drawing and released build package remain the primary requirements. Workmanship class, inspection coverage, electrical testing, records and nonconformance handling are agreed before material commitment.
- Revision-controlled production files
- Approved BOM and substitution rules
- First-article and process verification
- Risk-based inspection and test coverage
- Controlled rework and mandatory retest
- Records retained to the agreed scope
Quality stages
Five gates from material to shipment
- 01
Incoming inspection
Verify identity, condition and handling requirements.
- 02
Process inspection
Confirm setup, first article and in-process controls.
- 03
Electrical testing
Screen bare boards or assemblies by agreed method.
- 04
Assembly inspection
Check visible and hidden solder features by risk.
- 05
Final inspection
Verify configuration, records, labeling and packaging.
| Quality stage | What is checked | Typical evidence |
|---|---|---|
| Incoming inspection | PCB and component identity, condition, quantity and handling status | Receiving record and exception disposition by scope |
| Process inspection | Stencil, program, profile, first article and work-in-process status | Setup or first-article record by scope |
| Electrical testing | Bare-board continuity or assembly structural/functional behavior | Test result or summary by agreed plan |
| Assembly inspection | Placement, polarity, visible joints and hidden joints where required | Visual, AOI or X-ray record by scope |
| Final inspection | Revision, workmanship, labels, quantity, documentation and packaging | Release checklist and shipment record |
Inspection & testing matrix
Use the method that can detect the risk
| Method | Best used for | Important limitation |
|---|---|---|
| SPI | Solder-paste volume and deposition before placement | Does not prove component placement or electrical function |
| AOI | Visible placement, polarity and solder-joint conditions | Cannot fully see joints beneath bottom-terminated packages |
| X-ray | BGA, QFN and other hidden solder features | Coverage and acceptance criteria must be defined |
| Bare-board electrical test | PCB opens and shorts before assembly | Does not validate assembled product behavior |
| ICT / flying probe | Structural electrical faults where test access permits | Coverage depends on design access and economics |
| Functional test | Product behavior against defined inputs and outputs | Requires customer-defined procedure, limits and interfaces |
Certification status
Verify current documents before supplier approval
Certification status can change and scope matters. Request the current certificate pack, certificate number, issuing body, expiry date and covered site directly from our sales team. This website does not present planned certifications as completed.
Request current documentsStandards
Project requirements take precedence
Reference standards and workmanship classes should be stated on the purchase order or quality agreement. Regulated or safety-critical products require additional qualification and are accepted only after documented review.
Next step
Define the quality plan before quotation
Tell us the workmanship class, inspection coverage, test requirements, record retention and regulatory constraints that apply to your project.