Visual inspection and AOI

Visual methods detect placement, polarity and visible solder defects. AOI provides repeatable optical coverage but cannot see hidden joints beneath bottom-terminated packages.

X-ray inspection

X-ray reveals hidden solder features under BGA, QFN and similar packages. Sampling or full coverage should be decided according to package, process maturity and risk.

ICT and flying probe

Electrical structural tests can identify opens, shorts and component-value errors when test access and circuit design permit. Fixture economics matter for lower volumes.

Functional testing

FCT checks product behavior against defined inputs and outputs. The customer must define pass criteria, firmware, fixture interfaces and safe operating conditions.

Create a coverage matrix

Map critical failure modes to the method capable of detecting them. Record gaps instead of claiming an undefined percentage of test coverage.

PCBA inspection and test comparison

MethodTypical purposeWhat it does not establish
Visual / AOIVisible placement, orientation and solder featuresAll hidden joints or complete electrical function
X-rayHidden solder features under selected packagesComplete product behavior
ICTElectrical structural checks with suitable accessEvery operating state of the product
Flying probeProgrammable electrical checks with accessible nodesCoverage of inaccessible or isolated circuit features
Functional testSpecified behavior under controlled inputs and loadsUntested states or lifetime reliability

A test handoff needs more than a pass label

Specify hardware and firmware revision, test sequence, measurement limits and units, fixture connections, equipment requirements, operator instructions and records. Include how a failure is isolated and what must be repeated after rework. Separate workmanship acceptance from functional requirements: IPC describes assembly process and acceptance standards; the product team still defines what the product must do.

Functional test requirements to include in an RFQ

“Functional tested” is not a complete requirement. Define the behavior to be measured and the safe, repeatable procedure needed to reach a pass/fail decision. The actual test scope and feasibility require project review.

Test inputSpecifyQuestion before release
Unit and configurationPCB/BOM revision, product variant and firmwareWhich configuration is this procedure valid for?
Equipment and interfaceFixture, pinout, supplies, loads and safety constraintsWho supplies and validates the fixture or program?
Sequence and limitsInputs, measurements, timing and numerical pass/fail limitsCan another operator repeat the same decision?
Failure handlingStop, quarantine, authorized rework and retest rulesWho may decide disposition and shipment release?
RecordsAgreed unit/batch linkage and retention needsWhat evidence is included in the quotation?

Inspection remains separate from functional coverage. Include test readiness in the assembly schedule and price the agreed scope in the quotation comparison, rather than assuming either is included.

Technical references

Use the applicable standard revision and the component manufacturer's documentation when defining your requirements.

Use this guide in your next build review

Share the current revision, pilot result, expected batch size and unresolved risks. We will identify the information needed before quotation or production release.

Prepare an RFQ