Metal-core boards

MCPCB Manufacturer for Metal-Core and Thermal Boards

VeriPCB supports mcpcb manufacturer requirements for metal-core PCBs with thermal review, dielectric confirmation and assembly matched to the design.

What this service solves

A controlled path from requirements to acceptance

An mcpcb manufacturer deals with heat first. Dielectric layer, copper weight, thermal vias and component placement determine whether a metal-core board performs. We review these before committing material. See the custom PCBA scope or the capability review.

Best fit for

  • Power and high-current products
  • LED and lighting thermal boards
  • Automotive and industrial thermal designs
  • Teams needing dielectric confirmation

Scope

Typical project deliverables

The exact scope is frozen in the quotation and approved build documentation.

DeliverableControl pointCustomer output
01 · Engineering and DFM reviewConfirmed before material commitmentApproved assumptions and responsibilities
02 · PCB fabrication planningConfirmed before material commitmentApproved assumptions and responsibilities
03 · Component sourcing controlControlled during manufacturingRepeatable production instruction
04 · SMT and THT assemblyControlled during manufacturingRepeatable production instruction
05 · Inspection and testing by scopeVerified before releaseInspection, test or shipment evidence by scope
06 · Release records and shipmentVerified before releaseInspection, test or shipment evidence by scope

Typical build sequence

  1. 01

    Build package

    Gerber or ODB++, BOM, centroid, drawings, quantity and acceptance needs.

  2. 02

    Engineering review

    Resolve revision, manufacturability, material and test ambiguities.

  3. 03

    Fabrication & sourcing

    Prepare boards and approved components against the frozen package.

  4. 04

    Assembly

    Run SMT, THT and any agreed programming or mechanical work.

  5. 05

    Inspection & test

    Apply the project-specific visual, optical, X-ray and electrical plan.

  6. 06

    Release

    Verify records, labeling, packaging and shipment configuration.

Metal-core PCB requirements beyond the base metal

InputWhat to specifyWhy it matters
Thermal stackBase material, dielectric system and thicknessesThe dielectric and thermal interfaces affect heat transfer
Electrical isolationProduct-specific voltage and test requirementsThermal choices must also meet insulation needs
Mechanical interfaceOutline, mounting holes, flatness and heat-sink contactThe board must fit the complete thermal assembly
AssemblyComponent packages, soldering and handling constraintsHigh thermal mass affects process planning

Workflow

How a build moves forward

  1. 01

    Qualification

    Confirm product stage, quantities and commercial fit.

  2. 02

    File review

    Identify missing data and manufacturability conflicts.

  3. 03

    Quotation

    Separate material, fabrication, assembly, test and logistics assumptions.

  4. 04

    Approval

    Freeze revisions, alternates and acceptance criteria.

  5. 05

    Build & validation

    Manufacture against the approved package and record agreed results.

Before release

Issues to resolve with the build team

Record an owner and an agreed resolution for any issue that applies to your design.

  • Wrong dielectric rating for the heat load
  • Insufficient thermal vias or copper weight
  • Component too close to hot zones
  • Stack-up not confirmed before build
  • No thermal test or rating agreed

Buyer questions

Frequently asked questions

What is an MCPCB?

A metal-core PCB uses a metal base layer for heat dissipation, common in LED, power and high-current designs where thermal path matters.

What should an MCPCB quote confirm?

Dielectric rating, copper weight, thermal via strategy, stack-up and finish, matched to your thermal requirement.

Can you assemble metal-core boards?

Yes, where placement, inspection and any thermal or functional test are planned against the design and agreed scope.

How is thermal performance verified?

Only against a defined test condition; we do not state a thermal number without agreed measurement and limits.

What files are needed?

Gerber or ODB++ with stack-up, thermal spec, BOM with exact MPNs, centroid data and assembly drawings.

Will you protect my design?

Customer design files remain the customer's property. An NDA can be requested before confidential files are exchanged.

Next step

Ready for a build review?

Share your project stage, quantity and target date. We will confirm the files, process and testing information needed for an accurate quotation.